Main Profile

At A Glance

Mod-02 Lec-09 Wire bonding, TAB and flipchip-1

An Introduction to Electronics Systems Packaging by Prof. G.V. Mahesh, Department of Electronic system Engineering, IISc Bangalore.For more details on NPTEL visit http://nptel.iitm.ac.in
Length: 57:11

Contact

Questions about Mod-02 Lec-09 Wire bonding, TAB and flipchip-1

Want more info about Mod-02 Lec-09 Wire bonding, TAB and flipchip-1? Get free advice from education experts and Noodle community members.

  • Answer

Ask a New Question