Main Profile

At A Glance

Mod-03 Lec-14 Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps

An Introduction to Electronics Systems Packaging by Prof. G.V. Mahesh, Department of Electronic system Engineering, IISc Bangalore.For more details on NPTEL visit http://nptel.iitm.ac.in
Length: 59:13

Contact

Questions about Mod-03 Lec-14 Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps

Want more info about Mod-03 Lec-14 Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps? Get free advice from education experts and Noodle community members.

  • Answer

Ask a New Question